Method for fabricating thin metal layers from the liquid phase
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United States of America Patent
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Sep 14, 2004
Grant Date -
Sep 25, 2003
app pub date -
Mar 17, 2003
filing date -
Mar 15, 2002
priority date (Note) -
Expired
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Abstract
A method for producing metal layers on surfaces of semiconductor substrates includes the step of providing a semiconductor substrate having a surface. In this case, a precursor compound of a metal to be deposited is condensed out on the semiconductor surface and subsequently decomposed thermally. The method makes it possible to fill trenches with a high aspect ratio, it being possible to effectively suppress the formation of voids.
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