Method and device for controlled cleaving process
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United States of America Patent
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Sep 14, 2004
Issued Date -
N/A
app pub date -
Oct 9, 2002
filing date -
May 12, 1997
priority date (Note) -
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Abstract
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of forming a stressed region in a selected manner at a selected depth (20) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.
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