Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor
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United States of America Patent
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Sep 14, 2004
Grant Date -
Dec 5, 2002
app pub date -
Jul 25, 2002
filing date -
Jan 26, 1998
priority date (Note) -
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Abstract
A microelectronic package includes first and second microelectronic elements in spaced-apart relationship which are electrically interconnected by a plurality of flexible leads and a layer of anisotropic conductive material. The flexible leads having one end attached to terminals on one of the microelectronic elements extends away therefrom having its opposite tip end electrically interconnected to contacts on the other microelectronic element by virtue of an interposed layer of the anisotropic conductive material.
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