Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices
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United States of America Patent
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-
Sep 14, 2004
Grant Date -
Dec 5, 2002
app pub date -
Nov 30, 2001
filing date -
May 31, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multi-chip module has semiconductor devices and a wiring substrate for mounting the semiconductor devices, in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
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