Support assembly for an integrated circuit package having solder columns
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United States of America Patent
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Sep 14, 2004
Grant Date -
Jan 29, 2004
app pub date -
Jul 23, 2002
filing date -
Jul 23, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.
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