Surface mounted electrical components
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United States of America Patent
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Sep 14, 2004
Grant Date -
Apr 1, 2004
app pub date -
Sep 26, 2002
filing date -
Sep 26, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.
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