Single wafer type cleaning method and apparatus
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United States of America Patent
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Sep 21, 2004
Grant Date -
Oct 30, 2003
app pub date -
May 15, 2003
filing date -
May 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A single wafer type wet-cleaning technique for wet-cleaning wafers, individually, which are not stored in a cassette, at the front and back faces thereof simultaneously, in a sealed cleaning housing, whereby a plurality of chemical fluids are vertically and sequentially supplied from a number of upper side supply nozzles 25 and lower side supply nozzles 26 to the front and back faces of each wafer W to clean the same, and purified water is always caused to flow out of the lower side supply nozzles 26, 26, . . . , which do not supply chemical fluids, of the lower side supply nozzles, thereby preventing the occurrence of cross contamination of various chemical fluids between cleaning treatments.
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