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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
DOW CORNING CORPORATION	MIDLAND STATE OF MICHIGAN UNITED STATES OF AMERICA

International Classification(s)

• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chaudhury, Manoj Kumar	Bethlehem, PA	2	36
Goodwin, Andrew James	Cardiff, GB	13	309
Lee, Yeong Joo	Midland, MI	6	137
Parbhoo, Bhukandas	Sully Penarth, GB	14	129

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 21, 2004	US,6793759,B2   US6793759B2	GRANTED PATENT AS SECOND PUBLICATION
August 07, 2003	US,20030145940,A1   US20030145940A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 6793759

Method for creating adhesion during fabrication of electronic devices

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