Substrate processing apparatus
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United States of America Patent
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Sep 21, 2004
Grant Date -
May 1, 2003
app pub date -
Oct 25, 2002
filing date -
Oct 30, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A substrate processing apparatus injects gas from an injection port formed on a shielding surface of an atmosphere shielding part and sucks a substrate by Bernoulli effect. The substrate is sucked in a state coming into contact with a contact supporting surface of a support member provided on the atmosphere shielding part, and rotated with the upper surface shielded by a shielding surface of the shielding part. A solution supply part supplies a chemical solution to the lower surface of the substrate. Therefore, mist of a processing solution or the processing solution can be reliably prevented from reaching the upper surface of the substrate. Thus provided is a substrate processing apparatus capable of reliably preventing the mist of the processing solution or the processing solution from reaching the upper surface of the substrate.
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