Method for fabricating a structure for a microelectromechanical systems (MEMS) device
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United States of America Patent
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Sep 21, 2004
Grant Date -
Aug 14, 2003
app pub date -
Feb 12, 2002
filing date -
Feb 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.
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