Semiconductor device having pad
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United States of America Patent
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-
Sep 21, 2004
Grant Date -
Jul 22, 2004
app pub date -
Jul 3, 2003
filing date -
Jan 22, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a semiconductor device having a pad, a first conductor and a second conductor are arranged at a surface of the pad. The first conductor has hardness that is greater than that of the second conductor and not less than that of a probe stylus. The first conductor is arranged at the surface of the pad such that the probe stylus hits or rubs against the first conductor at least one time while the probe stylus is in contact with and sliding on the surface of the pad.
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