Electronic component and fabrication method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 21, 2004
Grant Date -
Aug 28, 2003
app pub date -
Feb 20, 2003
filing date -
Feb 27, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component, in which an electronic element 9 fixed onto a first electrically conductive film 7 is electrically connected to second electrically conductive films 8 arranged in substantially the same plane as that of the first electrically conductive film 7 and the electronic element 9 including peripheries of the first and second electrically conductive films 7 and 8 is covered by an encapsulation resin portion 11, has electrically conductive protrusions 13 formed on an exposed surface of the first and second electrically conductive films exposed from the encapsulation resin portion 11.
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