Accurate multi-ground inductors for high-speed integrated circuits
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United States of America Patent
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Sep 21, 2004
Grant Date -
Nov 20, 2003
app pub date -
May 15, 2002
filing date -
May 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A structure and method for implementing a precision inductive component within a high frequency integrated circuit is disclosed. The inductive component has a structure of multiple conductive layers dielectrically insulated from each other and located above an integrated circuit substrate. The inductive component comprises a spiral-like inductive layer made of a first conductive layer. Additionally, a number of additional ground planes, each patterned out of its own selected conductive layer to minimize an induced eddy current therein thus improving Q (quality factor) under high frequency operation, are employed with either a linear or a rotational offset amongst them to effect a corresponding amount of adjustment of an inductance value of the inductive component. A number of specific design cases are presented with their respective inductance and RF performance parameters.
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