Method of forming a slider/suspension assembly
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United States of America Patent
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Sep 28, 2004
Grant Date -
N/A
app pub date -
Dec 21, 2001
filing date -
Dec 21, 2001
priority date (Note) -
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Abstract
A slider/suspension design and assembly method include securing a slider to a suspension assembly for use in a magnetic disk drive data recording device. To this end, a solder fillet bond is applied at the leading edge surface of the slider to provide a structural connection of the slider to the flexure, while also enabling the slider-suspension assembly to be separated without damage during the process. The slider/suspension assembly is initiated by forming a plurality of sliders on a wafer, in such a manner that the trailing edge surfaces of the sliders form the front side of the wafer, and the leading edge surfaces of the sliders form the backside of the wafer. A plurality of thin film data transducing elements and a plurality of electrical contact pads are then formed on the wafer front side.
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- 15 United States
- 10 France
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- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| WESTERN DIGITAL TECHNOLOGIES INC | 5601 GREAT OAKS PARKWAY SAN JOSE CA 95119 |
International Classification(s)
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- [Patents Count]
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Thornton, Brian Scott | Santa Clara, CA | 2 | 117 |
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| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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