Electronic component mounting apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6796022
APP PUB NO 20020148109A1
SERIAL NO

10108989

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HITACHI HIGH-TECH INSTRUMENTS CO LTD1-1 SAKADA 1-CHOME OIZUMI-MACHI OURA-GUN GUNMA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Yoshiharu Oizumi-machi, JP 18 91
Kashitani, Hisayoshi Ota, JP 8 32
Seto, Katsuyuki Ota, JP 14 129

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