Single or dual buss thermal transfer system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Sep 28, 2004
Grant Date -
Dec 12, 2002
app pub date -
Jun 12, 2002
filing date -
Jun 12, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A cooling system for use in conjunction with electronic devices (such as a computer) is disclosed. The cooling system is composed of several segments that comprise a continuous thermal path from the heat producing electronic component to a primary fluid circuit. The system transfers the heat to a secondary fluid circuit. The primary circuit is sealed and allows the transfer of heat to the secondary circuit without the requirements of the secondary fluid being directly connected through hoses or other means to the electronic device.
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