Electroless plating solution and process
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United States of America Patent
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Sep 28, 2004
Grant Date -
Jul 22, 2004
app pub date -
Jan 21, 2003
filing date -
Jan 21, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.
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