Method and apparatus for improved electroplating fill of an aperture
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United States of America Patent
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-
Sep 28, 2004
Grant Date -
Oct 16, 2003
app pub date -
Apr 16, 2002
filing date -
Apr 16, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus is provided for filling apertures formed in a substrate surface by depositing materials that selectively inhibit or limit the formation or growth of subsequent layers used to fill an aperture. In one aspect, a method is provided for processing a substrate including providing a substrate having a field and apertures formed therein, wherein the apertures each have a bottom and sidewalls, depositing a seed layer on the bottom and sidewalls of the apertures, depositing a growth-inhibiting layer on at least one of the field of the substrate or an upper portion of the sidewalls of the apertures, and depositing a conductive layer on the growth-inhibiting layer and the seed layer. Deposition of the growth-inhibiting layer improves fill of the aperture from the bottom of the aperture up to the field of the substrate.
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