Semiconductor device and method for making the same
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United States of America Patent
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Sep 28, 2004
Grant Date -
Apr 17, 2003
app pub date -
Mar 28, 2002
filing date -
Feb 28, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.
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