Test methods, systems, and probes for high-frequency wireless-communications devices
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United States of America Patent
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Sep 28, 2004
Grant Date -
Jan 31, 2002
app pub date -
Nov 29, 2000
filing date -
Jul 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a ground contact surface with a surface area substantially greater than the contact surface area of the one signal probe tip for contacting another one of the contact regions of the electronic circuit. The ground probe is positioned between at least two of the signal probes.
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