Packaged optical micro-mechanical device
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United States of America Patent
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-
Sep 28, 2004
Grant Date -
Jan 30, 2003
app pub date -
Jul 24, 2001
filing date -
Jul 24, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaged optical micro-mechanical device. A die includes one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. A package frame includes an aperture and a package frame reference surface proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves are positioned relative to an optical interface reference plane adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.
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