Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
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United States of America Patent
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Oct 5, 2004
Grant Date -
Aug 14, 2003
app pub date -
Feb 12, 2002
filing date -
Feb 12, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An abrasive wheel is used to separate individual laminated chips from a strip by cutting through the copper bridging elements. The abrasive wheel is made up of abrasive particles bonded in a matrix having a high glass transition temperature and a cutting edge having a maximum thickness of the order of 350 micron, whereby the cut is substantially straight and free of smears and burrs.
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