Method for domain patterning in low coercive field ferroelectrics

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United States of America Patent

PATENT NO 6800238
SERIAL NO

10047550

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Abstract

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A method for domain patterning of nonlinear ferroelectric materials. The method seeks to reduce the formation of random and spontaneous micro-domains that typically result during thermal cycling of ferroelectric materials and which leads to patterning defects and degraded performance. In accordance with the invention, a ferroelectric wafer is provided with a conductive layer on the top and bottom surfaces of the wafer. A sufficient bias voltage is applied across the conductive layers to polarize the wafer into a single direction. At least one of the conductive layers is selectively patterned to form a conductive domain template. A sufficient revise bias voltage is then applied to the conductive domain template and a remaining conductive layer to produce the domain patterned structure. According to a preferred embodiment of the invention, the ferroelectric wafer is formed of LiNbO.sub.3 or LiTaO.sub.3.

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Patent Owner(s)

Patent OwnerAddress
SILICON LIGHT MACHINES CORPORATION6660 VIA DEL ORO SAN JOSE CA 95119

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miller, Gregory D Foster City, CA 41 3232

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