Semiconductor device including edge bond pads and related methods
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United States of America Patent
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Oct 5, 2004
Issued Date -
N/A
app pub date -
Aug 29, 2002
filing date -
Dec 31, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device including at least one contact pad disposed on an edge thereof. The semiconductor device may also include a protective overcoat layer. The present invention also includes a method of fabricating the semiconductor device, including forming disconnected notches in a semiconductor wafer, redirecting circuit traces into each of the notches, and singulating the semiconductor wafer along the notches to form bond pads on the edges of the resultant semiconductor devices. A method of attaching the semiconductor device to a carrier substrate includes orienting the semiconductor device nonparallel to a carrier substrate and establishing at least one electrical connection between the semiconductor device and the carrier substrate.
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