Wiring circuit board having bumps and method of producing same
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United States of America Patent
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-
Oct 5, 2004
Grant Date -
Apr 4, 2002
app pub date -
Sep 14, 2001
filing date -
Oct 3, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 .mu.m are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 .mu.m, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2.
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