Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
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United States of America Patent
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Oct 5, 2004
Grant Date -
Feb 5, 2004
app pub date -
Jul 31, 2002
filing date -
Jul 31, 2002
priority date (Note) -
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Abstract
An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes one or more vias having conductive material formed therein and witch extend from an active surface to a back surface of the semiconductor substrate. The redistrobution patterns are patterned on the back surface of the semiconductor substrate, extending from the conductive material in the vias to predetermined locations on the back surface of the semiconductor substrate that correspond with an interconnect pattern of another substrate for interconnection thereto.
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