Integrated power delivery and cooling system for high power microprocessors
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United States of America Patent
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Oct 5, 2004
Grant Date -
Mar 27, 2003
app pub date -
Nov 8, 2002
filing date -
Jul 15, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.
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