Indirect monitoring of semiconductor light source within a photonic package
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United States of America Patent
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Oct 12, 2004
Grant Date -
Sep 4, 2003
app pub date -
Mar 1, 2002
filing date -
Mar 1, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.
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