Semiconductor die package having mesh power and ground planes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 12, 2004
Grant Date -
Aug 29, 2002
app pub date -
May 31, 2001
filing date -
Feb 23, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.
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