Method of marking a substrate using an electret stencil
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United States of America Patent
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Oct 19, 2004
Grant Date -
Mar 4, 2004
app pub date -
Aug 30, 2002
filing date -
Aug 30, 2002
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Abstract
A stencil comprises an electret film, wherein the film has at least one perforation having a perimeter that defines an area, and wherein the area is greater than or equal to about one square centimeter. Methods of marking a substrate using stencils of the present invention are also disclosed.
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