Device and method for processing substrates
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United States of America Patent
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Oct 19, 2004
Grant Date -
N/A
app pub date -
Sep 28, 2001
filing date -
Dec 22, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.
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