Method for making conductive circuits using powdered metals
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United States of America Patent
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Oct 19, 2004
Grant Date -
May 15, 2003
app pub date -
Sep 10, 2001
filing date -
Sep 10, 2001
priority date (Note) -
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Abstract
A method for making an electrically conductive pattern, including: (a) depositing on a substrate a metal powder composition consisting essentially of at least one metal powder, wherein the substrate is selected from the group consisting of paper and materials that are at least about 10% compressible; and (b) densifying the composition to form a conductive pattern on the substrate.
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