Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
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United States of America Patent
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Oct 19, 2004
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app pub date -
Nov 5, 2002
filing date -
Nov 5, 2002
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Abstract
A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by vacuum pressure through the pores. The wafer is cut by directing UV pulses of laser energy at the conductive substrate using a solid-state laser. An adhesive membrane can be attached to the separated die to remove them from the mounting surface, or the die can otherwise be removed after cutting from the wafer.
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