Methods of bonding microelectronic elements
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United States of America Patent
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Oct 26, 2004
Grant Date -
Oct 3, 2002
app pub date -
Mar 7, 2002
filing date -
Mar 7, 2001
priority date (Note) -
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Abstract
A method of electrically interconnecting microelectronic elements comprises providing a first microelectronic element having contacts with protrusions and dipping the protrusions into a layer of bonding material. At least some of the bonding material is transferred onto the contacts. The contacts are bonded to conductive features of a second microelectronic element.
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