Selective deposition of a barrier layer on a metal film
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United States of America Patent
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Oct 26, 2004
Grant Date -
Sep 25, 2003
app pub date -
Dec 18, 2002
filing date -
Dec 21, 2001
priority date (Note) -
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Abstract
A method to selectively deposit a barrier layer on a metal film formed on a substrate is disclosed. The barrier layer is selectively deposited on the metal film using a cyclical deposition process including a predetermined number of deposition cycles followed by a purge step. Each deposition cycle comprises alternately adsorbing a refractory metal-containing precursor and a reducing gas on the metal film formed on the substrate in a process chamber.
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