Structure for temporarily isolating a die from a common conductor to facilitate wafer level testing
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United States of America Patent
Stats
-
Oct 26, 2004
Grant Date -
Mar 6, 2003
app pub date -
Aug 30, 2001
filing date -
Aug 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.
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- Non-US Classification not provided for expired patents
Cited Art Landscape
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- Citation Ranking not provided for expired patents
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