Lead frame and semiconductor device made using the lead frame
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United States of America Patent
Stats
-
Oct 26, 2004
Grant Date -
Jul 3, 2003
app pub date -
Dec 20, 2002
filing date -
Dec 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.
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