Packaging of MEMS devices using a thermoplastic
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United States of America Patent
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-
Oct 26, 2004
Issued Date -
N/A
app pub date -
Jul 3, 2002
filing date -
Feb 6, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectromechanical circuit includes a cover attached to a package substrate by a thermoplastic. A MEMS device is disposed between the cover and the packaging substrate. The thermoplastic is substantially free of solvents. In addition, surfaces of the device are substantially free of solvents. The cover, the packaging substrate, and the thermoplastic form a protective enclosure around the device. The MEMS device may be formed on a substrate. The substrate may be attached to the packaging substrate by a thermoplastic. The thermoplastic may also be substantially solvent-free. A method for forming the circuit includes heating a thermoplastic to a temperature sufficient to remove all solvent from the thermoplastic. The temperature may be above a boiling point of the solvent. The method also includes arranging the thermoplastic between the cover and the packaging substrate and applying pressure and heat to the thermoplastic to form a protective enclosure around the device.
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