Microelectronic spring with additional protruding member
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United States of America Patent
Stats
-
Nov 2, 2004
Grant Date -
Oct 17, 2002
app pub date -
Apr 12, 2001
filing date -
Apr 12, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Various structural features for modifying the performance characteristic of cantilevered microelectronic spring structures are disclosed. Generally, the features comprise a protruding member mounted between a supporting substrate and the transverse cantilever beam of a microelectronic spring structure, at a distance spaced apart from the supporting structure from which the beam is cantilevered. The protruding member may be equal to the clearance under the beam, less than the clearance under the beam, or adjustable in height; and may be attached or mounted to either the beam or the substrate. The protruding member may include an adjustable pressure device or an electronic element. The protruding member may induce a reverse wipe.
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