Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
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United States of America Patent
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Nov 2, 2004
Grant Date -
Feb 20, 2003
app pub date -
Jul 12, 2002
filing date -
Jul 16, 2001
priority date (Note) -
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Abstract
Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate including positioning a substrate comprising at least first dielectric material and second dielectric material disposed thereon in a polishing apparatus, polishing the substrate with a first polishing composition having a first selectivity, and polishing the substrate with a second polishing composition having a second selectivity greater than the first selectivity.
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