Dual interposer packaging for high density interconnect
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United States of America Patent
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Nov 2, 2004
Grant Date -
Jul 3, 2003
app pub date -
Dec 28, 2001
filing date -
Dec 28, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus that allows additional contact pads to be added to a package to support debug and test operations is disclosed. In a preferred embodiment, a circuit board apparatus includes a semiconductor package and an interposer for receiving the semiconductor package. The semiconductor package preferably includes a substrate having a matrix of conductive contact pads on both the top and bottom surfaces of the substrate. The interposer preferably includes a body having a matrix of interposer contact bumps on both the inner and outer surfaces of the body. Each interposer contact bump preferably includes a metal coating and is shaped to abut a contact pad of the semiconductor package.
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