Importance

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Abstract

Dopant of an n-type is deposited in the channel area of a p-type well of isolated gate floating gate NMOS transistors forming the memory cells of a memory device array connected in a NAND gate architecture. The dopant is provided by a tilt angle around the existing floating gate/control gate structure at the stage of the fabrication process where the floating gate/control structure is in existence, the field oxidation step may also have occurred, and implantation of the source and drain dopants may also have occurred. This forms a retrograde n-type distribution away from the direction of the surface of the substrate in the channel, which is also concentrated laterally toward the centerline axis of the gate structure and decreases towards the opposing source and drain regions. This deposition promotes buried-channel-like performance of the NMOS transistors connected in series in the NAND gate memory architecture. This reduces series resistance of the series-connected floating gate MOS devices, allowing the desired reduction in source/drain dopant levels in order to combat short channel effects.

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First Claim