Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 2, 2004
Grant Date -
Mar 27, 2003
app pub date -
Oct 21, 2002
filing date -
Mar 7, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.
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