Transducing head having improved studs and bond pads to reduce thermal deformation
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United States of America Patent
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Nov 2, 2004
Grant Date -
Jul 10, 2003
app pub date -
Oct 22, 2002
filing date -
Jan 4, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A transducing head formed upon a slider has a transducer, an electrical contact layer, a stud electrically connected to the contact layer, and a bond pad electrically connected to the stud. The electrical contact layer is electrically connected to the transducer. The stud is formed of a material having a coefficient of thermal expansion less than about 1.3 times a coefficient of thermal expansion of a slider material forming the slider. The bond pad has a metallic underlayer and a top layer. The metallic underlayer is formed of a material having a coefficient of thermal expansion less than about 1.1 times the coefficient of thermal expansion of the slider material.
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