Frit material and bonding method for microfluidic separation devices
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United States of America Patent
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Nov 9, 2004
Grant Date -
Aug 14, 2003
app pub date -
Sep 27, 2002
filing date -
Feb 13, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A frit for use in multi-layer microfluidic separation devices is provided. The frit comprises a polymeric membrane that may be securely bonded within the device and minimizes lateral wicking. A secure bond is ensured by treating the polymer to match its surface energy to that of the materials to which it is bound. Treatments include plasma treatment, irradiation and the application of acids.
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