Method for annealing an electrodeposition structure
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United States of America Patent
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Nov 9, 2004
Grant Date -
Sep 18, 2003
app pub date -
Mar 15, 2002
filing date -
Mar 15, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for annealing a structure formed by electrodeposition including providing the electrodeposition structure, the electrodeposition structure including an eletroformed mold, the electroformed mold having a nominal thickness between and including 0.5 mm to 8.0 mm and having a melting temperature; heating the electrodeposition structure to a temperature between ambient temperature and the melting temperature of the electrodeposition structure; isostatically pressurizing the electrodeposition structure to a pressure above ambient pressure; cooling the electrodeposition structure to ambient temperature; and depressurizing the electrodeposition structure to ambient pressure.
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