Puncture resistant polymeric films, blends and process
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United States of America Patent
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Nov 9, 2004
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app pub date -
Sep 22, 1999
filing date -
Jul 7, 1998
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Abstract
A polymer blend and mono-and multilayer films made therefrom suitable for processing or packaging articles which have an improved combination of properties e.g. such as lower tear strength and higher puncture resistance, or higher puncture resistance at both room temperature in air and at elevated temperatures in contact with water wherein the blend preferably has a first copolymer of ethylene and hexene-1 having a copolymer melting point of 80 to 98.degree. C., preferably of 80 to 92.degree. C.; a second copolymer of ethylene and at least one .alpha.-olefin having a copolymer melting point of 115 to 128.degree. C.; and a third copolymer of ethylene and a vinyl ester or alkyl acrylate and having a melting point of 60 to 110.degree. C., and a process for making such films, especially shrink films having at least 40% shrink at 90.degree. C. in at least one direction.
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