Printed circuit board capacitor structure and method
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United States of America Patent
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Nov 9, 2004
Issued Date -
N/A
app pub date -
May 12, 2003
filing date -
Nov 5, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A capacitive element for a circuit board or chip carrier is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured followed by being fully cured. The partially cured sheet is laminated to at least one other sheet of dielectric material and one of the sheets of conductive material. The total thickness of the two sheets of the dielectric component does not exceed about 4 mils and preferably does not exceed about 3 mils. The use of two or more sheets of dielectric material makes it very unlikely that two or more defects in the sheets of dielectric material will align, thus greatly reducing the probability of a defect causing a failure in test or field use.
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