Control signal transmitting method with package power pin and related integrated circuit package structure
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United States of America Patent
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Nov 9, 2004
Grant Date -
Dec 19, 2002
app pub date -
Dec 28, 2001
filing date -
Jun 13, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and a device are disclosed for transmitting a control signal to an option pad of an integrated circuit chip at its package level. The method includes the steps of: electrically isolating one of a plurality of commonly connected power transmitting pins of the integrated circuit package; connecting the electrically isolated power transmitting pin to the option pad to thereby transmit a control signal from outside through the electrically isolated power transmitting pin to the option pad.
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