Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step

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United States of America Patent

PATENT NO 6815237
SERIAL NO

10675680

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Abstract

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A testing apparatus for determining the etch bias associated with a semiconductor-processing step includes a substrate, a first cathode finger with a first width on the substrate, a second cathode finger with a second width on the substrate, and a cathode large area on the substrate wherein the cathode large area has a third width W' and a length L' that are both substantially larger than either of the first and second widths.

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Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brar, Berinder P S Newbury Park, CA 30 838
Li, James Chingwei San Diego, CA 56 258
Pierson, Jr Richard L Thousand Oaks, CA 8 85

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